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74LVC2245A Octal transceiver with direction pin, 30 series termination resistors; 5 Volt tolerant input/output; 3-state
Product specification Supersedes data of 1999 Jun 15 2002 Jun 10
Philips Semiconductors
Product specification
Octal transceiver with direction pin, 30 series 74LVC2245A termination resistors; 5 Volt tolerant input/output; 3-state
FEATURES * 5 V tolerant inputs/outputs for interfacing with 5 V logic * Wide supply voltage range from 1.2 to 3.6 V * CMOS low power consumption * Direct interface with TTL levels * Inputs accept voltages up to 5.5 V * Complies with JEDEC standard no. 8-1A * Integrated 30 termination resistors * Specified from -40 to +85 C and -40 to +125 C. DESCRIPTION The 74LVC2245A is a high-performance, low-power, low-voltage, Si-gate CMOS device, superior to most advanced CMOS compatible TTL families. Inputs can be driven from either 3.3 or 5 V devices. In 3-state operation, outputs can handle 5 V. These features allow the use of these devices as translators in a mixed 3.3 and 5 V environment. The 74LVC2245A is an octal transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. The 74LVC2245A features an output enable (OE) input for easy cascading and a send/receive (DIR) input for direction control. OE controls the outputs so that the buses are effectively isolated. The 74LVC2245A is designed with 30 series termination resistors in both HIGH and LOW output stages to reduce line noise. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 2.5 ns. SYMBOL tPHL/tPLH CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; (CL x VCC2 x fo) = sum of the outputs. 2. The condition is VI = GND to VCC. PARAMETER propagation delay An to Bn, Bn to An input capacitance power dissipation capacitance per buffer VCC = 3.3 V; notes 1 and 2 CONDITIONS CL = 50 pF; VCC = 3.3 V TYPICAL 3.3 4.0 13 ns pF pF UNIT
2002 Jun 10
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Philips Semiconductors
Product specification
Octal transceiver with direction pin, 30 series termination resistors; 5 Volt tolerant input/output; 3-state
ORDERING INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE 74LVC2245AD 74LVC2245ADB 74LVC2245APW FUNCTION TABLE See note 1. INPUTS OE L L H Note 1. H = HIGH voltage level; L = LOW voltage level; X = don't care; Z = high-impedance OFF-state. PINNING PIN 1 2, 3, 4, 5, 6, 7, 8, 9 10 11, 12, 13, 14, 15, 16, 17, 18 19 20 DIR A0 to A7 GND B7 to B0 OE VCC SYMBOL DIR L H X An A=B inputs Z -40 to +125 C -40 to +125 C -40 to +125 C PINS 20 20 20 PACKAGE SO SSOP TSSOP
74LVC2245A
MATERIAL plastic plastic plastic
CODE SOT163-1 SOT339-1 SOT360-1
INPUTS/OUTPUTS Bn inputs B=A Z
DESCRIPTION direction control input data inputs/outputs ground (0 V) data inputs/outputs output enable input (active LOW) supply voltage
2002 Jun 10
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Philips Semiconductors
Product specification
Octal transceiver with direction pin, 30 series termination resistors; 5 Volt tolerant input/output; 3-state
74LVC2245A
handbook, halfpage
DIR 1 A0 2 A1 3 A2 4 A3 5 A4 6 A5 7 A6 8 A7 9 GND 10
MNA363
20 VCC 19 OE 18 B0 17 B1 16 B2
2245
15 B3 14 B4 13 B5 12 B6 11 B7
Fig.1 Pin configuration.
handbook, halfpage
1
DIR OE
19
2
handbook, halfpage
A0 B0 18
19 1
G3 3EN1 (BA) 3EN2 (AB)
3
A1 B1 17
1 2 3 4 5 6 7 8 9
MNA365
4 2 18
A2 B2 A3 16
17 16
5 B3 6 A4 B4 7 A5 B5 8 A6 B6 9 A7 B7 11 12 13 14 15
15 14 13 12 11
MNA174
Fig.2 Logic symbol (IEEE/IEC).
Fig.3 Logic symbol.
2002 Jun 10
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Philips Semiconductors
Product specification
Octal transceiver with direction pin, 30 series termination resistors; 5 Volt tolerant input/output; 3-state
RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER supply voltage CONDITIONS for maximum speed performance for low-voltage applications VI VO Tamb tr, tf input voltage output voltage ambient temperature input rise and fall times VCC = 1.2 to 2.7 V VCC = 2.7 to 3.6 V output HIGH or LOW state output 3-state MIN. 2.7 1.2 0 0 0 -40 0 0
74LVC2245A
MAX. 3.6 3.6 5.5 VCC 5.5 +125 20 10 V V V V V
UNIT
C ns/V ns/V
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK VI IOK VO PARAMETER supply voltage input diode current input voltage output diode current output voltage VI < 0 note 1 VO > VCC or VO < 0 output HIGH or LOW state; note 1 output 3-state; note 1 IO IGND, ICC Tstg Ptot output source or sink current VCC or GND current storage temperature power dissipation per package SO SSOP and TSSOP Note 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. above 70 C derate linearly with 8 mW/K above 60 C derate linearly with 5.5 mW/K - - 500 500 mW mW VO = 0 to VCC CONDITIONS - -0.5 - -0.5 -0.5 - - -65 MIN. -0.5 MAX. +6.5 -50 +6.5 50 V mA V mA UNIT
VCC + 0.5 V +6.5 50 100 +150 V mA mA C
2002 Jun 10
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Philips Semiconductors
Product specification
Octal transceiver with direction pin, 30 series termination resistors; 5 Volt tolerant input/output; 3-state
DC CHARACTERISTICS Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output VI = VIH or VIL; voltage IO = -100 A VI = VIH or VIL; IO = -6 mA VI = VIH or VIL; IO = -12 mA VOL LOW-level output voltage VI = VIH or VIL; IO = 100 A VI = VIH or VIL; IO = 6 mA VI = VIH or VIL; IO = 12 mA ILI IOZ Ioff ICC ICC input leakage current VI = 5.5 V or GND VCC (V) 1.2 1.2 MIN. VCC - Tamb (C) -40 to +85 TYP.(1) MAX. - - - - - - 0 0.8 - - - 0.2 0.4 0.55 5 5 10 10 500
74LVC2245A
-40 to +125 MIN. VCC 2.0 - - VCC - 0.3 MAX. - - 0 0.8 -
UNIT
V V V V V V V V V V A A A A A
2.7 to 3.6 2.0 2.7 to 3.6 -
2.7 to 3.6 VCC - 0.2 VCC 2.7 3.0 VCC - 0.5 - VCC - 0.8 - 0 - - 0.1 0.1 0.1 0.1 5
VCC - 0.65 - VCC - 1 - - - - - - - - - 0.3 0.6 0.8 20 20 20 40 5000
2.7 to 3.6 - 2.7 3.0 3.6 - - - - - -
3-state output VI = VIH or VIL; 3.6 OFF-state current VO = 5.5 V or GND power off leakage VI or VO = 5.5 V supply quiescent supply current VI = VCC or GND; IO = 0 0.0 3.6
additional VI = VCC - 0.6 V; quiescent supply IO = 0 current per in. pin
2.7 to 3.6 -
Note 1. All typical values are measured at VCC = 3.3 V and Tamb = 25 C.
2002 Jun 10
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Philips Semiconductors
Product specification
Octal transceiver with direction pin, 30 series termination resistors; 5 Volt tolerant input/output; 3-state
AC CHARACTERISTICS GND = 0 V; tr = tf 2.5 ns.
74LVC2245A
Tamb (C) SYMBOL PARAMETER WAVEFORMS -40 to +85 -40 to +125 UNIT
MIN. TYP. MAX. MIN. MAX. VCC = 1.2 V tPHL/tPLH tPZH/tPZL tPHZ/tPLZ propagation delay An to Bn; Bn to An 3-state output enable time OE to An; OE to Bn 3-state output disable time OE to An; OE to Bn see Figs 4 and 6 - see Figs 5 and 6 - see Figs 5 and 6 - 26 28 12 - - - - - - - - - ns ns ns
VCC = 2.7 V tPHL/tPLH tPZH/tPZL tPHZ/tPLZ propagation delay An to Bn; Bn to An 3-state output enable time OE to An; OE to Bn 3-state output disable time OE to An; OE to Bn see Figs 4 and 6 1.5 see Figs 5 and 6 1.5 see Figs 5 and 6 1.5 4.0 5.9 3.8 7.3 9.5 6.9 1.5 1.5 1.5 9.5 12.0 9.0 ns ns ns
VCC = 3.0 to 3.6 V; note 1 tPHL/tPLH tPZH/tPZL tPHZ/tPLZ tsk(0) Notes 1. Typical values are measured at VCC = 3.3 V. 2. Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design. propagation delay An to Bn; Bn to An 3-state output enable time OE to An; OE to Bn 3-state output disable time OE to An; OE to Bn skew see Figs 4 and 6 1.5 see Figs 5 and 6 1.5 see Figs 5 and 6 1.7 note 2 3.3 4.7 3.4 6.3 8.2 5.9 1.0 1.5 1.5 1.7 8.0 10.5 7.5 1.5 ns ns ns ns
2002 Jun 10
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Philips Semiconductors
Product specification
Octal transceiver with direction pin, 30 series termination resistors; 5 Volt tolerant input/output; 3-state
AC WAVEFORMS
74LVC2245A
handbook, halfpage VI
An, Bn INPUT GND tPLH VOH Bn, An OUTPUT VOL
VM
VM
tPHL
VM
VM
MNA176
VM = 1.5 V at VCC 2.7 V; VM = 0.5VCC at VCC < 2.7 V; VOL and VOH are typical output voltage drop that occur with the output load.
Fig.4 The inputs An, Bn to outputs Bn, An propagation delays.
handbook, full pagewidth
VI OE input GND t PLZ VCC Qn output LOW-to-OFF OFF-to-LOW VOL t PHZ Qn output HIGH-to-OFF OFF-to-HIGH VOH VY VM GND outputs enabled outputs disabled outputs enabled
MNA395
VM
t PZL
VM VX t PZH
VM = 1.5 V at VCC 2.7 V; VM = 0.5VCC at VCC < 2.7 V; VX = VOL + 0.3 V at VCC 2.7 V; VX = VOL + 0.1 V at VCC < 2.7 V; VY = VOH - 0.3 V at VCC 2.7 V; VY = VOH - 0.1 V at VCC < 2.7 V.
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.5 3-state enable and disable times.
2002 Jun 10
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Philips Semiconductors
Product specification
Octal transceiver with direction pin, 30 series termination resistors; 5 Volt tolerant input/output; 3-state
74LVC2245A
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL 50 pF RL 500 VO RL 500
2 x VCC open GND
MNA368
SWITCH POSITION TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH SWITCH open 2 x VCC GND
VCC < 2.7 V 2.7 to 3.6 V VCC 2.7 V
VI
Definitions for test circuits: RL = Load resistor. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.6 Load circuitry for switching times.
2002 Jun 10
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Philips Semiconductors
Product specification
Octal transceiver with direction pin, 30 series termination resistors; 5 Volt tolerant input/output; 3-state
PACKAGE OUTLINES TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
74LVC2245A
SOT360-1
D
E
A
X
c y HE vMA
Z
20
11
Q A2 pin 1 index A1 (A 3) A
Lp L
1
e bp
10
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 6.6 6.4 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC MO-153 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 99-12-27
2002 Jun 10
10
Philips Semiconductors
Product specification
Octal transceiver with direction pin, 30 series termination resistors; 5 Volt tolerant input/output; 3-state
SO20: plastic small outline package; 20 leads; body width 7.5 mm
74LVC2245A
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
2002 Jun 10
11
Philips Semiconductors
Product specification
Octal transceiver with direction pin, 30 series termination resistors; 5 Volt tolerant input/output; 3-state
74LVC2245A
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 10 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC MO-150 EIAJ EUROPEAN PROJECTION A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 7.4 7.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.9 0.5 8 0o
o
ISSUE DATE 95-02-04 99-12-27
2002 Jun 10
12
Philips Semiconductors
Product specification
Octal transceiver with direction pin, 30 series termination resistors; 5 Volt tolerant input/output; 3-state
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
74LVC2245A
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2002 Jun 10
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Philips Semiconductors
Product specification
Octal transceiver with direction pin, 30 series termination resistors; 5 Volt tolerant input/output; 3-state
Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not suitable(3)
74LVC2245A
SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable
suitable not not recommended(4)(5) recommended(6)
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2002 Jun 10
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Philips Semiconductors
Product specification
Octal transceiver with direction pin, 30 series termination resistors; 5 Volt tolerant input/output; 3-state
DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS
74LVC2245A
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2002 Jun 10
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613508/03/pp16
Date of release: 2002
Jun 10
Document order number:
9397 750 09841

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